Patents

I have been named on a total of 9 patents. I am the first name on 4 of the first 5 patents listed here.

The last 5 are related and a continuation of the work I started on the “NanoAmp” with my team at II-VI

Micro splice protector

US10209447B2

Abstract

A micro splice protector for a fusion connection between a pair of optical fibers takes the form of a cylindrical sleeve of dimensions similar to that of the fusion splice itself, with an epoxy material used to encase the fusion splice within the sleeve. The sleeve is formed to exhibit an inner diameter only slightly greater than the outer diameter of the optical fibers, with the length of the sleeve typically formed to be only slightly longer than the stripped end terminations of the pair of fibers being spliced together. The cylindrical sleeve is formed of a rigid, but lightweight, material (e.g., stainless steel, fused silica) and an epoxy material is injected into the configuration to fill any gaps between the fusion connection and the inner surface of the sleeve. The result is relatively stiff fusion splice protector that is extremely small in size and well-suited for use in optical component packages where space is at a minimum.

Note: this splice sleeve is only Ø0.5mm!

Monolithic Two-Dimensional Optical Fiber Array

US20180074266A1

Abstract

A two-dimensional (2D) optical fiber array component takes the form of a (relatively inexpensive) fiber guide block that is mated with a precision output element. The guide block and output element are both formed to include a 2D array of through-holes that exhibit a predetermined pitch. The holes formed in the guide block are relatively larger than those in precision output element. A loading tool is used to hold a 1×N array of fibers in a fixed position that exhibits the desired pitch. The loaded tool (holding the pre-aligned 1×N array of fibers) is then inserted through the aligned combination of the guide block and output element, and the fiber array is bonded to the guide block. The tool is then removed, re-loaded, and the process continued until all of the 1×N fiber arrays are in place. By virtue of using a precision tool to load the fibers, the guide block does not have to be formed to exhibit precise through-hole dimensions, allowing for a relatively inexpensive guide block to be used.

Tiltable Cabinet Drawer

US20200229599A1

Abstract

A cabinet drawer is configured to fully extend from within a cabinet case, tilting downward and outward when fully extended to allow personnel to access items located at the rear of the drawer. Mating channels and slots in the drawer and associated support structure allow for fully movement of the drawer, while preventing its disengagement from the cabinet. The inclusion of downward tiltable drawer provides easy access to the contents of drawer, regardless of its height.

Note: This drawer can retract and drop from both sides of the cabinet

Free Space Variable Optical Attenuator With Integrated Input/Output Power Monitors

US20180210151A1

Abstract

A free space variable optical attenuator (VOA) utilizes a beamsplitter to create tap beams (of both the input signal and the beam-steered output signal) that are directed into monitoring photodiodes. The beamsplitter is configured to exhibit a non-equal splitting ratio such that the tap beams are only a relatively small portion of the input/output beams. The free space configuration eliminates the need for fiber-based couplers, splices and connections to external monitors, as required in prior art VOA monitoring systems. The VOA utilizes a voltage-controlled, MEMS-based tilt mirror to provide beam steering of the propagating, free space beam in a known manner to introduce attenuation (power reduction) in the output signal.

Note: This device sits comfortably on a dime!

Flexible structured optical modules

WO2016154090A1

Abstract

Optical modules as used in various types of communication systems are formed to include a flexible substrate to support various optical, electronic, and opto-electronic module components in a manner that can accommodate various packaging constraints. The flexible substrate is formed of a polyimide film is known to exhibit excellent electrical isolation properties, even though the films are generally relatively thin (on the order of 10-100 μηΐ5, in most cases). The flexible polyimide film is sized to accommodate the constraints of a given package “footprint”; more particularly, sized to fit an open ‘floor area’ within package, allowing for a populated film to be placed around various other “fixed-in-place” elements. The polyimide film is easily cut and trimmed to exhibit whatever topology is convenient, while providing enough surface area to support the affixed components and associated optical fiber traces.

Optical amplifier module

WO2016149622A1

Abstract

An optical amplifier module is configured as a multi-stage free-space optics arrangement, including at least an input stage and an output stage. The actual amplification is provided by a separate fiber-based component coupled to the module. A propagating optical input signal and pump light are provided to the input stage, with the amplified optical signal exiting the output stage. The necessary operations performed on the signal within each stage are provided by directing free- space beams through discrete optical components. The utilization of discrete optical components and free-space beams significantly reduces the number of fiber splices and other types of coupling connections required in prior art amplifier modules, allowing for an automated process to create a “pluggable” optical amplifier module of small form factor proportions.

Compact optical fiber amplifier

US10749309B2

Abstract

A fiber-based optical amplifier is assembled in a compact configuration by utilizing a flexible substrate to support the amplifying fiber as flat coils that are “spun” onto the substrate. The supporting structure for the amplifying fiber is configured to define the minimal acceptable bend radius for the fiber, as well as the maximum diameter that fits within the overall dimensions of the amplifier package. A pressure-sensitive adhesive coating is applied to the flexible substrate to hold the fiber in place. By using a flexible material with an acceptable insulative quality (such as a polyimide), further compactness in the final assembly is achieved by locating the electronics in a space underneath the fiber enclosure.

Compact optical fiber amplifier (Japan)

JP2019021909A

Abstract

To provide an optical fiber coil supporting structure in which an amplifying fiber portion of an optical amplifier is miniaturized. SOLUTION: A fiber-based optical amplifier is assembled in a compact configuration by utilizing a flexible substrate to support an amplifying fiber as flat coils that are “spun” onto the substrate. A supporting structure for the amplifying fiber 20 is configured to define the minimal acceptable bend radius for the fiber, as well as the maximum diameter that fits within the overall dimensions of an amplifier package. Pressure-sensitive adhesive coating is applied to the flexible substrate 30 to hold the fiber in place. By using flexible material with an acceptable insulating quality (such as a polyimide), further compactness in a final assembly is achieved by locating electronic components in a space underneath a fiber enclosure.

Compact optical fiber amplifier (International)

WO2016149435A1

Abstract

A fiber-based optical amplifier is assembled in a compact configuration by utilizing a flexible substrate to support the amplifying fiber as flat coils that are “spun” onto the substrate. The supporting structure for the amplifying fiber is configured to define the minimal acceptable bend radius for the fiber, as well as the maximum diameter that fits within the overall dimensions of the amplifier package. A pressure-sensitive adhesive coating is applied to the flexible substrate to hold the fiber in place. By using a flexible material with an acceptable insulative quality (such as a polyimide), further compactness in the final assembly is achieved by 1 ocating the electronics in a space underneath the fiber enclosure.